JPH0427819Y2 - - Google Patents
Info
- Publication number
- JPH0427819Y2 JPH0427819Y2 JP4030885U JP4030885U JPH0427819Y2 JP H0427819 Y2 JPH0427819 Y2 JP H0427819Y2 JP 4030885 U JP4030885 U JP 4030885U JP 4030885 U JP4030885 U JP 4030885U JP H0427819 Y2 JPH0427819 Y2 JP H0427819Y2
- Authority
- JP
- Japan
- Prior art keywords
- lid
- receiver
- integrated circuit
- packaged
- thin film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 2
- 239000010409 thin film Substances 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 239000004033 plastic Substances 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000006082 mold release agent Substances 0.000 description 3
- 239000011253 protective coating Substances 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000004793 Polystyrene Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000010408 film Substances 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Stackable Containers (AREA)
- Closures For Containers (AREA)
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4030885U JPH0427819Y2 (en]) | 1985-03-20 | 1985-03-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4030885U JPH0427819Y2 (en]) | 1985-03-20 | 1985-03-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61156674U JPS61156674U (en]) | 1986-09-29 |
| JPH0427819Y2 true JPH0427819Y2 (en]) | 1992-07-03 |
Family
ID=30549075
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4030885U Expired JPH0427819Y2 (en]) | 1985-03-20 | 1985-03-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0427819Y2 (en]) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000062749A (ja) * | 1998-08-14 | 2000-02-29 | Kokuyo Co Ltd | 収納ケース |
| JP2002002695A (ja) * | 2000-06-15 | 2002-01-09 | Kyocera Corp | 基板収納トレイ及びこれを用いた基板梱包体 |
| JP4514327B2 (ja) * | 2000-12-27 | 2010-07-28 | 京セラ株式会社 | 半導体素子収納用パッケージの包装容器 |
| JP4836358B2 (ja) * | 2001-06-15 | 2011-12-14 | 富士通化成株式会社 | 搬送トレー |
| KR200463094Y1 (ko) * | 2007-09-17 | 2012-10-16 | (주)엘지하우시스 | 창호형 핸들의 휴대 수납케이스 |
| JP5448949B2 (ja) * | 2010-03-16 | 2014-03-19 | 日本特殊陶業株式会社 | 配線基板用容器 |
| JP5678494B2 (ja) * | 2010-07-02 | 2015-03-04 | 富士通セミコンダクター株式会社 | 電子デバイス用収納容器 |
| JP5609548B2 (ja) * | 2010-11-02 | 2014-10-22 | 富士通セミコンダクター株式会社 | 半導体チップトレイ及び半導体チップの搬送方法 |
| JP5814832B2 (ja) * | 2012-03-06 | 2015-11-17 | 三菱電機株式会社 | 収納容器 |
| JP6652362B2 (ja) * | 2015-09-30 | 2020-02-19 | 東京応化工業株式会社 | 基板ケース、収納部、及び、基板搬送器 |
| TWI728922B (zh) * | 2020-10-07 | 2021-05-21 | 頎邦科技股份有限公司 | 捲帶封裝的儲放構造及其載盤 |
-
1985
- 1985-03-20 JP JP4030885U patent/JPH0427819Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61156674U (en]) | 1986-09-29 |
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